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MediaTek Dimensity 920 and Dimensity 810 5G chips launched

MediaTek has launched two new 5G chipsets for smartphones namely Dimensity 920 and Dimensity 810. Both the Dimensity 5G chips are designed on a 6nm process with a 64-bit octa-core CPU. The two processors will be equipped with mid-range smartphones and are expected to ship later this year in Q3. 

Let’s have a look at the in-depth specifications of the Dimensity 920 and Dimensity 810 chipsets.

MediaTek Dimensity 920 Features

MediaTek has developed the Dimensity 920 based on a 6nm process including two ARM Cortex-A78 clocked at 2.5Ghz and six ARM Cortex-A55 clocked at 2.0GHz. The graphics need is handled by an ARM Mali-G68 MC4. The chipset is said to perform 9% better than its predecessor Dimensity 900. It supports LPDDR4x and LPDDR5 RAM paired with up to UFS 3.1 storage standard.

The Dimensity 920 is designed to support a 120Hz refresh rate FHD+ display, 108MP camera sensor or dual 20MP sensors, and video resolution of 4K at 30fps. For wireless connectivity, the SoC supports multi-mode 5G, Wi-Fi 6, and Bluetooth 5.2. For navigation, it offers a multi-GNSS system including GPS, BeiDou, Glonass, Galileo, QZSS, and NavIC.

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MediaTek Dimensity 810 Features

The Dimensity 810 is affordable between the two 5G chips from MediaTek. It is also built on a 6nm process with octa-cores and 64-bit CPUs. It includes four ARM Cortex-A76 and four ARM Cortex-A55 CPUs with a clock speed of 2.4GHz and 2.0GHz respectively. The 810 chip is paired with an Arm Mali-G57 MC2 GPU and supports LPDDR4X RAM with UFS 2.2 standard for internal storage. 

The Taiwan-based chip manufacturer has designed the Dimensity 810 to support 64MP cameras or dual 16MP sensors. The devices with this chip may include an FHD+ display with a resolution of 120Hz. It is equipped with a 5G modem that supports up to 2CC carrier aggregation, mixed duplex FDD + TDD CA, Dual 5G SIM, and VoNR Service. The 810 chipset offers Wi-Fi 5 and Bluetooth 5.1 versions.

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“Delivering a boost in performance, display intelligence, and image brilliance, these new Dimensity chipsets will improve user experiences and deliver advanced 5G features and capabilities to 5G smartphones,” said Dr. JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit.

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